
Worked on the EOSCogniton/ELIZ-2022 repository, focusing on hardware design and manufacturability improvements for temperature sensor PCBs. Over two months, addressed a critical footprint issue by correcting thermistor and connector definitions to align with updated component libraries, reducing rework risk and supporting library modernization. Enhanced the PCB layout to enable temperature sensor placement on both sides, upgraded connector footprints from 1.27mm to 2.54mm pitch, and standardized Gerber output directories for consistent manufacturing outputs. Utilized KiCad and C++ for component footprint management, electronics engineering, and PCB design, delivering targeted enhancements that improved production readiness and bill of materials clarity.
June 2025 — Delivered PCB design enhancements for EOSCogniton/ELIZ-2022 enabling temperature sensor placement on both sides, with updated footprints, nets, and layer configurations. Replaced 1.27mm pitch connector footprints with 2.54mm pitch and standardized the Gerber output directory to Outputs/; updated project and library settings for consistency. Changes align with manufacturing readiness and thermal sensing reliability, and are tracked via commits pcb_therm and dernière version temps sensors. No major defects reported; minor footprint and routing refinements completed to improve manufacturability and BOM clarity.
June 2025 — Delivered PCB design enhancements for EOSCogniton/ELIZ-2022 enabling temperature sensor placement on both sides, with updated footprints, nets, and layer configurations. Replaced 1.27mm pitch connector footprints with 2.54mm pitch and standardized the Gerber output directory to Outputs/; updated project and library settings for consistency. Changes align with manufacturing readiness and thermal sensing reliability, and are tracked via commits pcb_therm and dernière version temps sensors. No major defects reported; minor footprint and routing refinements completed to improve manufacturability and BOM clarity.
May 2025 (EOSCogniton/ELIZ-2022) focused on correcting the Temperature Sensor PCB footprint and connector pin definitions to align with updated component libraries, improving manufacturability and production readiness. The work reduced risk of rework and supported ongoing library modernization.
May 2025 (EOSCogniton/ELIZ-2022) focused on correcting the Temperature Sensor PCB footprint and connector pin definitions to align with updated component libraries, improving manufacturability and production readiness. The work reduced risk of rework and supported ongoing library modernization.

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