
Amy contributed foundational improvements to the stanford-ssi/samwise-avionics repository, focusing on enhancing the design integrity and manufacturability of the avionics PCB. She restructured the KiCad component UUIDs and model directories, updating capacitor and resistor models to ensure accurate referencing throughout the design files. Amy also defined production-ready layouts by introducing comprehensive ground and power planes, zones, and signal routing areas, directly supporting electrical functionality and manufacturing efficiency. By resolving USB-C footprint references at the root level, she mitigated potential misrouting and production errors. Her work demonstrated depth in electronics engineering, hardware development, and PCB design using KiCad.
September 2025 highlights for stanford-ssi/samwise-avionics: Implemented foundational changes to improve design integrity, manufacturability, and traceability of the avionics PCB. Key work included a KiCad component UUIDs and model directory restructuring, a thorough update of capacitor/resistor models, and the introduction of comprehensive production definitions for zones, ground/power planes, and signal routing areas. A critical USB-C footprint reference fix from the root was completed to prevent misrouting and production errors. These efforts reduce rework risk, accelerate handoffs to manufacturing, and strengthen end-to-end traceability from design to BOM.
September 2025 highlights for stanford-ssi/samwise-avionics: Implemented foundational changes to improve design integrity, manufacturability, and traceability of the avionics PCB. Key work included a KiCad component UUIDs and model directory restructuring, a thorough update of capacitor/resistor models, and the introduction of comprehensive production definitions for zones, ground/power planes, and signal routing areas. A critical USB-C footprint reference fix from the root was completed to prevent misrouting and production errors. These efforts reduce rework risk, accelerate handoffs to manufacturing, and strengthen end-to-end traceability from design to BOM.

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