During July 2025, Andres Osorio focused on hardware-software integration for the Electrical Conductivity Measurement System in the Kuper0173/Smart-irrigation-system-Digital-I repository. He delivered two new hardware revisions, Prueba3 and Prueba4, updating both Verilog HDL hardware and C/Assembly firmware for the FemtoRV32 processor. His work included developing build scripts and comprehensive documentation to streamline deployment and maintenance. By managing hardware revisions and automating build processes, Andres improved sensor reliability and enabled faster iteration cycles. The project demonstrated depth in embedded systems development, FPGA design, and firmware deployment, addressing the need for scalable, maintainable hardware in digital irrigation systems.
July 2025 monthly summary for Kuper0173/Smart-irrigation-system-Digital-I: Focused on hardware-software integration for the Electrical Conductivity Measurement System. Delivered Versiones 3 y 4 (Prueba3/Prueba4) of Conductividad_eléctrica with new hardware revisions and firmware updates for the FemtoRV32 processor, supported by extensive Verilog hardware design and C/Assembly firmware across the module. Build scripts and documentation were created to streamline deployment and maintenance. Major bugs fixed: none documented for this period. Overall impact includes improved sensor reliability, hardware scalability, and faster deployment of revisions. Technologies/skills demonstrated include Verilog, embedded C/Assembly, firmware deployment, hardware revision management, build automation, and thorough documentation. Commit reference: fe24bc1080596130d75ff9ca1505b5810041637d.
July 2025 monthly summary for Kuper0173/Smart-irrigation-system-Digital-I: Focused on hardware-software integration for the Electrical Conductivity Measurement System. Delivered Versiones 3 y 4 (Prueba3/Prueba4) of Conductividad_eléctrica with new hardware revisions and firmware updates for the FemtoRV32 processor, supported by extensive Verilog hardware design and C/Assembly firmware across the module. Build scripts and documentation were created to streamline deployment and maintenance. Major bugs fixed: none documented for this period. Overall impact includes improved sensor reliability, hardware scalability, and faster deployment of revisions. Technologies/skills demonstrated include Verilog, embedded C/Assembly, firmware deployment, hardware revision management, build automation, and thorough documentation. Commit reference: fe24bc1080596130d75ff9ca1505b5810041637d.
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