
Arnav Goyal delivered a hardware retrofit for the MIDAS-MK2 Pyro Board in the ISSUIUC/ISS-PCB repository, focusing on improved power control and reliability for pyro triggering. He replaced the high-side pyro switch and routed new MOSFETs, addressing safety and reducing the risk of power or control failures. Using Kicad Schematic for hardware design and PCB layout, Arnav established detailed commit-level traceability to support future firmware integration and cross-team collaboration. The work demonstrated depth in power electronics and disciplined version control, laying a foundation for robust hardware updates while ensuring maintainability and reliability in the board’s actuation systems.

Month: 2025-01 — ISS-PCB (ISSUIUC/ISS-PCB) delivered the MIDAS-MK2 Pyro Board Hardware Retrofit, updating hardware for improved power control and reliability in pyro triggering. Key actions included replacing the high-side pyro switch and routing new MOSFETs to support safer actuation. This month established strong traceability via commits 78d2a0ac82522caf878885cc8794cf93a1e3fa10 and 714718a5ed4ad8558289c0a4f25e3c5e6f58d66d. No major bugs reported this period. Overall impact: increased reliability and safety in pyro triggering, reduced risk of power/control failures, and a foundation for future firmware integration. Technologies demonstrated: hardware design for power electronics, MOSFET routing, high-side switch replacement, version control discipline, and cross-team collaboration.
Month: 2025-01 — ISS-PCB (ISSUIUC/ISS-PCB) delivered the MIDAS-MK2 Pyro Board Hardware Retrofit, updating hardware for improved power control and reliability in pyro triggering. Key actions included replacing the high-side pyro switch and routing new MOSFETs to support safer actuation. This month established strong traceability via commits 78d2a0ac82522caf878885cc8794cf93a1e3fa10 and 714718a5ed4ad8558289c0a4f25e3c5e6f58d66d. No major bugs reported this period. Overall impact: increased reliability and safety in pyro triggering, reduced risk of power/control failures, and a foundation for future firmware integration. Technologies demonstrated: hardware design for power electronics, MOSFET routing, high-side switch replacement, version control discipline, and cross-team collaboration.
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