June 2026 accomplishments focused on delivering end-to-end AMD ACP 7.X TDM support across SOF and Zephyr, consolidating DAI/DMA routing, 24-bit alignment, and topology/template integration. Key features delivered include AMD TDM support across the SOF framework (DAI/DMA routing, 24-bit alignment, ACP TDM topology templates) and ACP 7.X TDM enablement on AMD boards (board/config patches). Topology templates for ACP 7.X I2S-TDM were added to topology tooling. On Zephyr, ACP 7.X TDM support was extended across DAI, DMA, and device-tree, with DAI/DMA driver updates and device-tree nodes. Device-tree now exposes three TDM DAI instances (tdm_dai0/1/2) and a unified acp_tdm_dma node with default dma-channels set to 6. This work establishes an end-to-end, end-user visible TDM path from application to hardware across AMD ACP 7.X, including preparation for 16/24/32-bit sample formats and I2S/TDM configurations. Demonstrated cross-repo collaboration and a strong emphasis on business value: expanded platform support, reduced integration risk, and a solid foundation for further ACP 7.X features and future AMD platforms.

Concise monthly summary for 2024-10 focusing on delivering ACP_6_0 SoC support in the sof repo, with build compatibility and configuration cleanup. Highlights include fix of Kconfig.soc build error and alignment of board.yaml with Zephyr conventions to enable reliable integration and build success for the new SoC. This work reduces hardware integration risk and accelerates time-to-market for ACP_6_0 platforms.