EOSCogniton/ELIZ-2022
May 2025 – Jun 2025
2 Months active
Languages Used
KiCadC++
Technical Skills
Component Footprint ManagementHardware DesignPCB LayoutElectronics EngineeringKiCadPCB Design
zahe29
PROFILE
Zahe29
Oriane Baugas-Villers enhanced the EOSCogniton/ELIZ-2022 hardware by updating temperature sensor PCB layouts to support dual-side placement and improve manufacturability. She addressed compatibility issues by correcting thermistor footprints and adjusting connector pin definitions to align with new component libraries, reducing rework risk and supporting production readiness. Using KiCad and C++, Oriane upgraded connector footprints from 1.27mm to 2.54mm pitch, standardized Gerber output directories, and refined routing for better BOM clarity. Her work focused on component footprint management and electronics engineering, resulting in a more robust, production-ready PCB design that aligns with evolving library standards and manufacturing requirements.
Overall Statistics
Feature vs Bugs
50%Features
Repository Contributions
3Total
Bugs
1
Commits
3
Features
1
Lines of code
13,045
Activity Months2
Your Network
18 peopleSame Organization
@etu.ec-lyon.fr7
Work History
June 2025
2 Commits • 1 Features
Jun 1, 2025June 2025 — Delivered PCB design enhancements for EOSCogniton/ELIZ-2022 enabling temperature sensor placement on both sides, with updated footprints, nets, and layer configurations. Replaced 1.27mm pitch connector footprints with 2.54mm pitch and standardized the Gerber output directory to Outputs/; updated project and library settings for consistency. Changes align with manufacturing readiness and thermal sensing reliability, and are tracked via commits pcb_therm and dernière version temps sensors. No major defects reported; minor footprint and routing refinements completed to improve manufacturability and BOM clarity.
2 Commits • 1 Features
Jun 1, 2025June 2025 — Delivered PCB design enhancements for EOSCogniton/ELIZ-2022 enabling temperature sensor placement on both sides, with updated footprints, nets, and layer configurations. Replaced 1.27mm pitch connector footprints with 2.54mm pitch and standardized the Gerber output directory to Outputs/; updated project and library settings for consistency. Changes align with manufacturing readiness and thermal sensing reliability, and are tracked via commits pcb_therm and dernière version temps sensors. No major defects reported; minor footprint and routing refinements completed to improve manufacturability and BOM clarity.
June 2025
May 2025
1 Commits
May 1, 2025May 2025 (EOSCogniton/ELIZ-2022) focused on correcting the Temperature Sensor PCB footprint and connector pin definitions to align with updated component libraries, improving manufacturability and production readiness. The work reduced risk of rework and supported ongoing library modernization.
May 2025
1 Commits
May 1, 2025May 2025 (EOSCogniton/ELIZ-2022) focused on correcting the Temperature Sensor PCB footprint and connector pin definitions to align with updated component libraries, improving manufacturability and production readiness. The work reduced risk of rework and supported ongoing library modernization.
Activity
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Quality Metrics
Correctness83.4%
Maintainability80.0%
Architecture80.0%
Performance63.4%
AI Usage20.0%
Skills & Technologies
Programming Languages
C++KiCad
Technical Skills
Component Footprint ManagementElectronics EngineeringHardware DesignKiCadPCB DesignPCB Layout
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