April 2026 — Key feature delivered: Enhanced Nedeljkovic-Soref-Mashanovich interpolation in tidy3d, enabling linear, nearest, zero, and log-space interpolation for perturbation coefficients. This increases interpolation flexibility and accuracy in simulations. Implemented in the tidy3d-client with commit 68718d7c3604eaf7b38a428c8406a7f8b84199eb (FXC-6634).

Monthly summary for 2026-02 focusing on feature delivery and robustness improvements in the tidy3d repository, with clear business value and technical impact. Key features delivered: - Fragment removal in unstructured grids before meshing to prevent small cell volumes and improve mesh quality. Commit: 8b7b1d79f2c89e9e6e31053d481110e9a9e49d38 - Cylinder geometry minimum radius enforcement with clamping and minimum mesh size testing to improve robustness of unstructured-grid meshing. Commit: 64f752317241863b2bc36805e700313509baa9d9 Major bugs fixed: - No major bugs fixed this month in the scope of tidy3d meshing features. Ongoing stabilization work complemented feature delivery. Overall impact and accomplishments: - Improved mesh reliability and quality by removing internal fragments/boundaries prior to meshing, reducing risk of invalid meshes. - Enhanced geometry validation with a minimum radius function and supporting tests, leading to more robust meshing workflows and fewer edge-case failures. - Strengthened code quality and test coverage around meshing workflows, enabling more predictable simulation outcomes for customers. Technologies/skills demonstrated: - Unstructured-grid meshing concepts, geometry processing, and robustness testing. - Feature-driven development with clear commit messages and links to FXC-related work items. - Basic test coverage for geometry and mesh size validation, contributing to stable releases.

January 2026 monthly work summary: Implemented critical correctness and validation improvements across tidy3d-notebooks and tidy3d, delivering more accurate simulations, proactive error prevention, and test coverage; reinforced business value by reducing incorrect results and unnecessary meshing issues.

December 2025 monthly summary for flexcompute/tidy3d focused on delivering core Heat-Charge simulation enhancements, robustness improvements, and clearer visualization. The work strengthens simulation integrity, improves user guidance, and enhances business value by enabling more accurate analyses and reliable visuals.

November 2025: Delivered two key features in tidy3d-notebooks to improve model fidelity and TCAD data integration, along with a robustness fix in tidy3d visualizations. Implemented non-isothermal charge analysis for the Thermo-Optic Doped Modulator and fixed a visualization edge-case to robustly handle empty doping data. These changes enhance accuracy, reliability, and user experience, providing clearer insights for design decisions and faster iteration cycles.

Month: 2025-10 – Focused on stabilizing Charge simulations in flexcompute/tidy3d. Delivered a critical bug fix to the Charge Simulation Monitor validation and reinforced the reliability of monitor handling. The change enforces that TemperatureMonitor and SteadyPotentialMonitor must be unstructured, and clarifies that support for structured monitors is limited to Temperature and Potential types. This reduces misconfiguration risk, improves simulation correctness for end users, and supports better downstream analytics and tooling. Commit reference included for traceability: ef3d257581796280f6a4b031cec6a6ca8de512d9.

September 2025: Delivered a focused set of enhancements to the Charge Simulation Framework in flexcompute/tidy3d, enabling spatially varying generation via DistributedGeneration, new CustomDoping models for semiconductor concentrations, non-isothermal charge simulations, and updated density of states/bandgap handling. Improved mesh size estimation validation lifecycle, fixed a doping contribution calculation issue, and released accompanying API/docs updates. These changes broaden modeling capability, improve accuracy, and reduce onboarding risk through better validation and documentation.

July 2025 performance summary for flexcompute/tidy3d: Delivered a new Steady Current Density Monitor feature to enable robust simulation and analysis of current density in charge/conduction scenarios, along with targeted robustness improvements across conduction simulations. Implemented data structures, test fixtures, and data handling to support the feature. Strengthened simulation reliability through validation of ChargeConductorMedium, improved edge-case handling in doping calculations, and safer access/validation of solid medium properties for unsteady heat simulations. These changes reduce risk of incorrect results, improve test coverage, and lay groundwork for more advanced diagnostics. Technologies demonstrated include Python-based numerical simulation development, testing, and data-driven validation, contributing to higher product quality and user trust.

June 2025: Key delivery across tidy3d improvements—time-dependent heat analysis, robust input validation, and electrostatics enhancements—driving more accurate simulations, reducing runtime errors, and improving maintainability through tests and docs.

May 2025 monthly summary focusing on delivering high-impact features, improving robustness, and expanding developer-facing tooling across tidy3d and tidy3d-notebooks. Highlights include new physics capabilities, API/docs enhancements, input handling improvements, comprehensive testing, and notebook-level performance optimizations that collectively boost model fidelity, reliability, and developer productivity.

April 2025 monthly summary focusing on key accomplishments: Deliverables across unsteady heat simulations, visualization accuracy, system robustness, and performance improvements, with a direct impact on solver capabilities, reliability, and time-to-solution for DC and transient analyses.

In March 2025, delivered key data-modeling and solver integration improvements across tidy3d and its notebooks, with a focus on accurate data access, physical perturbation modeling, and notebook workflows. Highlights include new cell-value APIs for unstructured grids, a Nedeljkovic–Soref–Mashanovich perturbation model with tests, refactored material checks for HeatChargeSimulation to SolidMedium, a thermo-optic modulator notebook now using Tidy3D's native solver, and fixes to current-density units for plotting.

February 2025 monthly summary for flexcompute projects (tidy3d and tidy3d-notebooks). Delivered core semiconductor modeling updates, improved accuracy for high-doping regimes, and streamlined electro-optic simulations through tighter integration with Tidy3D's Charge solver. Key improvements include a refactored mobility model and FossumCarrierLifetime for more accurate carrier dynamics, robust 2D doping axis handling, and the adoption of Fermi-Dirac statistics in DC analysis. Also migrated Mach-Zehnder Interferometer (MZI) electro-optic simulations to the Tidy3D Charge solver, enabling direct carrier distribution modelling in device simulations. Updated notebooks and materials definitions to reflect these capabilities, supporting reproducibility and broader adoption.

Month: 2025-01. Delivered core semiconductor simulation enhancements in tidy3d and strengthened notebook tooling. Implemented Charge Solver API and MultiPhysicsMedium to support Drift-Diffusion simulations and extended property definitions beyond optics. Enhanced 2D doping logic with from_bounds and improved initialization in ConstantDoping/GaussianDoping, and updated Scene to process tuple inputs. Introduced robust validation for doping boxes and mandatory semiconductor parameters to prevent zero-sized boxes and misconfigurations. Also launched a Charge Simulation Validation Notebook and updated HeatChargeSimulation notebooks to improve accuracy and usability. These changes improve simulation reliability, extend capabilities for semiconductor design workflows, and reduce debugging time for users. Techs demonstrated include Python API design, 2D/3D simulation workflows, validation, and notebook-based tooling.