April 2026 monthly summary: A coordinated push across WirenBoard repositories delivered unified firmware release management, enhanced template capabilities, and broader sensor support, delivering tangible business value through reliable upgrades and improved device monitoring. In wirenboard/wb-releases, we implemented consolidated firmware versioning across WB-MCM, WB-MS, MIR, and MAI2, introduced the mcm8Gec signature, and refined releases.yaml to enable granular control over firmware targets (MS vs MSW), enabling customers to access latest features and fixes via coordinated firmware versions while improving release tracking. In wirenboard/wb-mqtt-serial, we delivered a WB-MCM8-HV template enhancement introducing an input state bit mask for improved state management, and extended templates for WB-MS v2 and WB-MIR to support multiple 1-Wire sensors with artefact fixes to ensure reliability. These changes collectively improve upgrade reliability, user experience, and cross-device feature delivery, accelerating time-to-value for customers and reducing post-release support.

In March 2026, delivered a global firmware version update across WB modules in wirenboard/wb-releases, aligning WB-MCM, WB-MIR, and WB-MAI2/MAI2G3 to the latest releases to ensure compatibility and improved functionality. The work included targeted updates across multiple projects and test FW, with explicit commits and issue references to enable auditability and reproducibility. Result: reduced version drift, smoother deployments, and a stronger baseline for future releases.