
Developed the ESP32 Bluetooth Module PCB design for the Terrapin-Rocket-Team/SRAD-Avionics repository, delivering both schematic and layout to enable hardware integration of Bluetooth-enabled avionics. The work focused on supporting the ESP32-WROOM-32D module, incorporating essential passive components, a JST EH connector, and mounting holes to facilitate rugged deployment and rapid prototyping. Using KiCad for schematic capture and PCB layout, the developer emphasized design for manufacturability and ensured version control traceability for future validation and iteration. This feature accelerates hardware prototyping and provides a foundation for secure wireless communication, supporting downstream software integration and streamlined avionics subsystem development.
January 2025 monthly summary for Terrapin-Rocket-Team/SRAD-Avionics: Delivered the ESP32 Bluetooth Module PCB Design (Schematic and Layout), enabling hardware integration for Bluetooth-enabled avionics. The PCB supports ESP32-WROOM-32D, essential passives, a JST EH connector, and mounting holes to facilitate rugged deployment and rapid prototyping. No major bugs fixed this month; validation work is planned in the next cycle. Business value: accelerates hardware prototyping, enables secure wireless capabilities, and supports downstream software integration. Technologies demonstrated: PCB design, schematic capture, PCB layout, component selection, design for manufacturability, and version control traceability.
January 2025 monthly summary for Terrapin-Rocket-Team/SRAD-Avionics: Delivered the ESP32 Bluetooth Module PCB Design (Schematic and Layout), enabling hardware integration for Bluetooth-enabled avionics. The PCB supports ESP32-WROOM-32D, essential passives, a JST EH connector, and mounting holes to facilitate rugged deployment and rapid prototyping. No major bugs fixed this month; validation work is planned in the next cycle. Business value: accelerates hardware prototyping, enables secure wireless capabilities, and supports downstream software integration. Technologies demonstrated: PCB design, schematic capture, PCB layout, component selection, design for manufacturability, and version control traceability.

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