
During January 2025, Daniel Rivas designed and delivered the ESP32 Bluetooth Module PCB for the Terrapin-Rocket-Team/SRAD-Avionics repository, focusing on enabling hardware integration for Bluetooth-enabled avionics. He used KiCad to create both the schematic and PCB layout, supporting the ESP32-WROOM-32D module, essential passive components, a JST EH connector, and mounting holes for rugged deployment. His work emphasized design for manufacturability and traceability, preparing assets for future validation and iteration. By establishing a clear hardware integration pathway, Daniel accelerated rapid prototyping and supported downstream software integration, demonstrating depth in electronics engineering, PCB design, and schematic capture within a short timeframe.

January 2025 monthly summary for Terrapin-Rocket-Team/SRAD-Avionics: Delivered the ESP32 Bluetooth Module PCB Design (Schematic and Layout), enabling hardware integration for Bluetooth-enabled avionics. The PCB supports ESP32-WROOM-32D, essential passives, a JST EH connector, and mounting holes to facilitate rugged deployment and rapid prototyping. No major bugs fixed this month; validation work is planned in the next cycle. Business value: accelerates hardware prototyping, enables secure wireless capabilities, and supports downstream software integration. Technologies demonstrated: PCB design, schematic capture, PCB layout, component selection, design for manufacturability, and version control traceability.
January 2025 monthly summary for Terrapin-Rocket-Team/SRAD-Avionics: Delivered the ESP32 Bluetooth Module PCB Design (Schematic and Layout), enabling hardware integration for Bluetooth-enabled avionics. The PCB supports ESP32-WROOM-32D, essential passives, a JST EH connector, and mounting holes to facilitate rugged deployment and rapid prototyping. No major bugs fixed this month; validation work is planned in the next cycle. Business value: accelerates hardware prototyping, enables secure wireless capabilities, and supports downstream software integration. Technologies demonstrated: PCB design, schematic capture, PCB layout, component selection, design for manufacturability, and version control traceability.
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