
Jackie Lee contributed to the ISS-PCB repository over four months, focusing on hardware design and PCB development using KiCad and schematic capture tools. Jackie delivered four hardware features, including integrating an ADC expander, adding pull-up resistors for I2C reliability, and supporting a second stepper driver for Motor-MK1 to enable higher torque. Their work included schematic updates for power management, signal integrity, and grounding improvements, such as correcting ESP32 3V3 grounding. All changes were hardware-focused, with clear commit traceability and readiness for validation. Jackie’s approach emphasized robust hardware integration, manufacturability, and risk reduction through careful schematic and PCB design.
In 2025-04, focused on hardware routing improvements for the Motor-MK1 PCB and a critical ESP32 grounding fix, delivering measurable reliability and manufacturability gains. All changes have clear traceability to commits and are ready for validation.
In 2025-04, focused on hardware routing improvements for the Motor-MK1 PCB and a critical ESP32 grounding fix, delivering measurable reliability and manufacturability gains. All changes have clear traceability to commits and are ready for validation.
Combined month-end summary for 2025-03 focused on hardware feature delivery in the ISS-PCB repo. Delivered second stepper driver support (TMC2660C) for Motor-MK1, enabling higher torque or dual-drive capability. Completed pin connections for the new driver in the Motor-MK1 schematic and added clear traceability around the hardware variant via commit history. No major bugs fixed this period; effort centered on feature delivery and groundwork for hardware validation.
Combined month-end summary for 2025-03 focused on hardware feature delivery in the ISS-PCB repo. Delivered second stepper driver support (TMC2660C) for Motor-MK1, enabling higher torque or dual-drive capability. Completed pin connections for the new driver in the Motor-MK1 schematic and added clear traceability around the hardware variant via commit history. No major bugs fixed this period; effort centered on feature delivery and groundwork for hardware validation.
In 2024-11, ISS-PCB delivered a MIDAS-MK2-Pyro hardware design update, improving power management and signal integrity. The schematic was updated to connect DRDY to a GPIO expander and to add dedicated power isolation components, enhancing interaction between DRDY-driven peripherals and power rails. These changes strengthen power integrity and reduce cross-talk, enabling more robust pyro sensing/control workflows. The update is tracked via a single commit for traceability: 251522147bdc363a7fd450da5421f8d350d4fc31.
In 2024-11, ISS-PCB delivered a MIDAS-MK2-Pyro hardware design update, improving power management and signal integrity. The schematic was updated to connect DRDY to a GPIO expander and to add dedicated power isolation components, enhancing interaction between DRDY-driven peripherals and power rails. These changes strengthen power integrity and reduce cross-talk, enabling more robust pyro sensing/control workflows. The update is tracked via a single commit for traceability: 251522147bdc363a7fd450da5421f8d350d4fc31.
October 2024 monthly hardware engineering summary for ISS-PCB. Focused on hardware design updates to enable new capabilities and ensure signaling reliability, with traceable commits and no software logic changes.
October 2024 monthly hardware engineering summary for ISS-PCB. Focused on hardware design updates to enable new capabilities and ensure signaling reliability, with traceable commits and no software logic changes.

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