
Jackie Lee contributed to the ISS-PCB repository by designing and updating hardware systems for embedded applications, focusing on schematic capture and PCB layout using KiCad. Over four months, Jackie delivered features such as integrating an ADC expander, enhancing I2C signal integrity with pull-up resistors, and adding power isolation for improved component interaction. She also implemented dual stepper driver support and optimized power distribution and grounding on the Motor-MK1 board, addressing reliability and manufacturability. All changes were hardware-focused, traceable through detailed commits, and prepared for validation, demonstrating a methodical approach to hardware engineering and robust schematic design.

In 2025-04, focused on hardware routing improvements for the Motor-MK1 PCB and a critical ESP32 grounding fix, delivering measurable reliability and manufacturability gains. All changes have clear traceability to commits and are ready for validation.
In 2025-04, focused on hardware routing improvements for the Motor-MK1 PCB and a critical ESP32 grounding fix, delivering measurable reliability and manufacturability gains. All changes have clear traceability to commits and are ready for validation.
Combined month-end summary for 2025-03 focused on hardware feature delivery in the ISS-PCB repo. Delivered second stepper driver support (TMC2660C) for Motor-MK1, enabling higher torque or dual-drive capability. Completed pin connections for the new driver in the Motor-MK1 schematic and added clear traceability around the hardware variant via commit history. No major bugs fixed this period; effort centered on feature delivery and groundwork for hardware validation.
Combined month-end summary for 2025-03 focused on hardware feature delivery in the ISS-PCB repo. Delivered second stepper driver support (TMC2660C) for Motor-MK1, enabling higher torque or dual-drive capability. Completed pin connections for the new driver in the Motor-MK1 schematic and added clear traceability around the hardware variant via commit history. No major bugs fixed this period; effort centered on feature delivery and groundwork for hardware validation.
In 2024-11, ISS-PCB delivered a MIDAS-MK2-Pyro hardware design update, improving power management and signal integrity. The schematic was updated to connect DRDY to a GPIO expander and to add dedicated power isolation components, enhancing interaction between DRDY-driven peripherals and power rails. These changes strengthen power integrity and reduce cross-talk, enabling more robust pyro sensing/control workflows. The update is tracked via a single commit for traceability: 251522147bdc363a7fd450da5421f8d350d4fc31.
In 2024-11, ISS-PCB delivered a MIDAS-MK2-Pyro hardware design update, improving power management and signal integrity. The schematic was updated to connect DRDY to a GPIO expander and to add dedicated power isolation components, enhancing interaction between DRDY-driven peripherals and power rails. These changes strengthen power integrity and reduce cross-talk, enabling more robust pyro sensing/control workflows. The update is tracked via a single commit for traceability: 251522147bdc363a7fd450da5421f8d350d4fc31.
October 2024 monthly hardware engineering summary for ISS-PCB. Focused on hardware design updates to enable new capabilities and ensure signaling reliability, with traceable commits and no software logic changes.
October 2024 monthly hardware engineering summary for ISS-PCB. Focused on hardware design updates to enable new capabilities and ensure signaling reliability, with traceable commits and no software logic changes.
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